Trade Lead Description:
1. Application
The SSP series of spherical fused silica powder have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the electronic packaging, chip packaging, photovoltaic cell chip packaging, special engineering plastic products, inks, paints, pigments, daily chemical products and so on.
2. Main Specifications
SiO2 Purity: 99.95% min.
Size: D50, 1-10um per the user’s demands.
| Type of Offer: |
Offer to Sell |
| Quantity: |
Not Specified |
| Packaging: |
Packing by brown paper drum with 25kg net per drum (25Kg/Drum) or 25Kg net per pp bag within plastic inner bag. |
| Price / Incoterms Conditions: |
Not Specified |
Posted from China - Beijing on 25 August, 2011
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Trade Leads Directory -> All Trade Leads -> Base Metals & Articles -> Miscellaneous Articles -> Supply spherical fused silica
